吉川研究室で設計したチップの写真




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Die Photograph of ADC using 65nm CMOS Technology.

2010 International Conference on Solid State Devices and Materials (SSDM2010)
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Die Photograph of UWB Differential LNA using 180nm CMOS Technology.

2010 International Conference on Solid State Devices and Materials (SSDM2010)
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Die Photograph of BPSK detector using TSMC 180nm CMOS Technology.

2010 International Conference on Solid State Devices and Materials (SSDM2010)
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Die Photograph of ADC using 65nm CMOS Technology.

2009 International Conference on Solid State Devices and Materials (SSDM2009)
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Die Photograph of UWB Wireless inter-chip communication on PCB by integrated meander dipole antenna and LNA using 180nm CMOS Technology.

2009 International Conference on Solid State Devices and Materials (SSDM2009)
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Die chip photograph of UWB transmitter and receiver with on-chip antenna

・2008 IEEE Radio and Wireless Symposium.
・2009 Asia-Pacific Microwave Conference.
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Die Photograph of BPSK receiver using TSMC 180nm CMOS Technology.

2009 International Conference on Solid State Devices and Materials (SSDM2009)
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Die chip photograph of UWB transmitter and receiver with on-chip antenna.

2006 International Conference on Solid State Devices and Materials. (SSDM 2006)
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Die chip photograph of UWB transmitter with on-chip antenna.

2006 Symposium on VLSI Circuits.
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Die chip photograph of UWB receiver.

2005 International Workshop on UWB Technologies.